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8th Workshop on Irregular Applications: Architectures and Algorithms

In conjunction with SC18
Sponsored by IEEE TCHPC


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Important Dates

  • Abstract Submission: August 22, 2018
  • Position or Regular Paper Submission: August 29, 2018
  • Notification: September 28, 2018
  • Camera-ready: October 10, 2018
  • Workshop: November 12, 2018


Submission site:

Submitted manuscripts may not exceed eight (8) pages in length for regular papers and four (4) pages for position papers including figures, tables and references.
Authors of regular papers will be able to provide up to one (1) additional pages for the Artifact Description (AD) appendix and, after paper acceptance, up to two (2) additional pages for the Artifact Evaluation (AE) appendix.

The workshop proceedings will be published through IEEE TCHPC and will be included in the IEEE Xplore digital library.

The templates are available at:

Artifact Description & Evaluation

This edition of the workshop invites authors of regular papers to follow a reproducibility initiative like the main SC Conference, with specific appendices for the Artifact Description (AD) and the Artifact Evaluation (AE). Please refer to the SC reproducibility page for further details on the rationale behind AD and AE:

Authors of regular papers will be able to use up to one (1) additional page to provide an Artifact Description (AD) Appendix, describing the details of their software environments and computational experiments to the extent that an independent person could replicate their results. This additional page is voluntary, and must focus only on details on software environments and methods to execute the experiments. It should not add details on the proposed technical approaches. If a paper has no computational results, the appendix only needs to mention that computational results are not part of the paper.

Additionally, authors of accepted regular papers will be invited to formally submit their supporting materials to the Artifact Evaluation (AE) process. The process is voluntary, but authors that will participate in the AE will be eligible for the Best Paper Award of the workshop. Supporting materials for the AE include access to the actual software artifact, shared pubblicly (for example, through the CK - Collective Knowledge - format), and two (2) further additional pages of the paper that details how to reproduce the results of the paper. For details on how to submit supporting materials to the AE process, please refer to: Authors participating in the AE will receive an assessment of the artifact, and the related badge on their paper. 

For any additional question on the AD and the AE  please contact the Artifact Evaluation Chair Flavio Vella at

ACM TOPC Special Issue

Authors interested in the topics of the workshop are also invited to submit papers to the thematic Special Issue on Innovations in Systems for Irregular Applications of ACM Transactions on Parallel Computing (TOPC).

We invite, in particular, authors of papers accepted to previous editions of the workshop, as well as authors of accepted papers to the upcoming edition, to submit exteded versions of their paper. Deadline for the submission to the special issue is October 31, 2018, i.e., after the notification for this year edition of the workshop, but slightly before the workshop itself.

For more information on the TOPC Special Issue on Innovations in Systems for Irregular Applications, including details on submissions and important dates, please consult the following link: